The Basic Steps of PCB Circuit Board CAM Production

Each PCB board is basically composed of an aperture, drill layer, circuit layer, solder resist layer, character layer, in the CAM350, each layer will be loaded in different color zones separately, in order to facilitate the operation. The following is the basic steps of PCB CAM production.

1. Import file

First automatically import files (file-->import-->autoimport) and examination data are complete, the alignment layers (edit-->layers-->align) and set origin position (edit-->change-->origin-->datum coordinate), the layer arrangement (edit-- >layers-->reorder) according to a certain order, the layer would be useless to delete edit-->layers-->reorder.

2, Treatment of drilling

When customers did not provide drill files, you can use converted into flash (utilities-->draw-->custom, utilities-->draw-->flash-->interactive) turn into borehole drilling for editing, utilities-->gerber to drill) aperture position;

Then inspect the smallest hole size, hole edge and the edge of the hole or slot minimum spacing (analysis-->check drill), the edge of the hole edge and forming minimum distance (info-->measure-->object-object) whether meet the process capability.

3, line processing

The first measurement of minimum diameter, line spacing (analysis-->drc), to see if they meet the process capability. Then the wire diameter compensation according to the thickness of the copper foil board type PC and substrate (edit-->change-->dcode), check the line pad has no offset relative to the drill hole (if pad has edit--> layers-->snap pad to, using the drill command; if drilling is biased the use of edit-->layers-->snap drill, to pad, pad ring) command line is large enough (analysis-->drc), and npth line hole, groove edge, forming edge distance meets the pad requirements of.Npth production line hole (edit-->delete). Then whether to cancel the DRC examination after the completion of the above lines and lines, and pad, whether spacing pad and pad meet the production requirements.

4,Anti welding process

Check solder and circuit pad matching (analysis-->drc), solder and line spacing, plates welded with the circuit pad spacing (line and soldermask copy to a layer, then analysis-->drc command to check this layer), preventing electrode from the minimum width, npth whether have sizes solder block (add-->flash).

5, Word processing

Check the text line width (info-->report-->dcode), height (info-->measure-->point-point), diameter hollow, text and line pad spacing, text and shaping of the edge distance, text and fishing hole or slot spacing, text and not eat tin PTH pitch whether or not to meet the requirements of the production. Ran after according to customer requirements add UL Mark and date code marking.

6, Work with contiguous edge processing

According to the specified contiguous contiguous edit-->copy, processing of the side. Then add AI hole drilling for editing, add-->drill hit), the positioning hole, optical, customer material number (add-->text), Yang Xuan material number. Need V-CUT to guide the V-CUT angle (edit-->line change-->fillet, if need to fillet with the following command: edit-->line change-->chamfer. Some of the also requires et chapter, V-CUT test points, broken drill hole, the second the drilling plates stay test line and pad, the identification mark etc..

7, Layout and process side of the production

According to the layout of the table on the layout of the layout, according to the production of standardized production process

8, The composite layer

peration: tables-->composites. according to the add increase a (name, bkg for setting the screen figure polarity (positive and negative), dark to multiply attributes (layer), clear negative attributes (reduced layer).

9, Output drilling and light drawing data

Cam finished recording the original film, the minimum line work piece size, line spacing and foil area (analysis-->copper area).

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